Heat-Electric Field Conversion Model for Measuring Current Density: A Combined Simulation and Experimental Study
ID：79
Submission ID：129 View Protection：ATTENDEE
Updated Time：2024-10-23 10:38:34
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Oral Presentation
Start Time：2024-11-02 09:50 （Asia/Shanghai）
Duration：20min
Session：[P2] Parallel Session 2 » [P2-2] Parallel Session 2（November 2 AM）
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Abstract
The distribution of current density is crucial for the performance, reliability, and thermal management of electronic devices and conductive materials. Based on heat conduction theory and Joule's law, this paper establishes a model for converting the thermal field to current under AC heat sources and proposes a non-contact method for measuring current density. This method uses an infrared thermal imager to extract temperature distribution and indirectly derive current density, offering high spatial resolution. By separating steady-state periodic variations from transient temperature rises in the distribution, finite element simulations confirmed the proposed coupling between thermal and electric fields, revealing that the amplitude of temperature variations at twice the current frequency is positively correlated with current amplitude and inversely correlated with frequency. The results show that high-resolution temperature distributions obtained via infrared thermography can quantitatively detect current density distribution, aiding in reliability analysis of electronic devices and conductive materials, with significant potential applications in materials science and electrical engineering.
Keywords
Infrared thermal camera, Current density, Thermal field-electric field coupling, Non-contact measurement
Speaker
RenChao
Dr. Chengdu Aircraft Industrial (Group) Co., Ltd.Submission Author
All comments
15th August 2024 31st August 2024- Manuscript Submission
15th September 2024 - Acceptance Notification
1st October 2024 - Camera Ready Submission
1st October 2024 – Early Bird Registration
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